深圳市科明隆电子有限公司

• 5000W peak pulse capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% • Glass passivated chip junction in P600 package • Fast response time: typically less than 1.0ps from 0 Volts to BV min • Excellent clamping capability • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • Low incremental surge resistance • Typical IR less than 2μA when VBR min>12V • High temperature to reflow soldering guaranteed: 260°C/40sec / 0.375”, (9.5mm) lead length, 5 lbs., (2.3kg) tension • VBR @ TJ = VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) • Plastic package is flammability rated V-0 per Underwriters Laboratories • Matte tin lead–free plated • Halogen free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-